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KMB16F

型号封装

型号:KMB16F          

封装:MBF-4 (SOP-4)

特性:快恢复芯片、贴片桥堆


参数说明

★电性参数:1A 60V

★芯片材质:GPP

★正向电流(Io):1A

★芯片个数:4

★正向电压(VF):0.7V

★芯片尺寸:50MIL

★浪涌电流Ifsm:30A

★是否进口:是

★漏电流(Ir):10uA

★工作温度:-40~+150℃

★恢复时间(Trr):5ns

★引线数量:4